层数：14层     板厚：2.2mm               

材料：刚性部分  碳氢化合物＋陶瓷＋玻璃布

      挠性部分  pi+粘结片                                   

盲孔：1-4层； 1-6层； 7-14层；11-14层        

最小孔径：0.3mm                                    

最小线宽线距：6mil/6mil                     

最小焊环：6mil                              

表面处理：图电金 

应用领域：高频通讯、平面显示器、汽车电子、航空航天器等

Rigid-flex Printed Circuit Board

Base material:  rigid substrate    hydrocarbon+ceramic+glass

             flexible substrate  pi+adhesive

Layers coverage:14 layers   

Thickness：2.2mm

Blind vias:layer1-4;layer1-6;layer7-14;layer11-14

Min driller size:0.3mm   

Min.line/space:6mil/6mil

Min.annular ring:6mil

Surface finishes:gold-plated

Applications:

High frequency Transmission;Flat panel display;Autormobile electronic.Aerobat&Spacecraft etc